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ten layer HDI circuit Board

1. Reduce the cost of PCB: when the density of PCB increases more than eight layers, the cost of HDI manufacturing will be lower than the traditional complex pressing process.
2, increase the line density: the interconnection of traditional circuit board

Parameters

    Product parameters:

    name of product:Ten layer HDI circuit board

    number of board   :10 layer

    Material: FR-4 

    Finished product thickness: 1.6MM

    Finished copper  thickness: 35UM

    Surface treatment: immersion gold

    Minimum aperture:

    Minimum line width: 

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Product Detail

 

1. Reduce the cost of PCB: when the density of PCB increases more than eight layers, the cost of HDI manufacturing will be lower than the traditional complex pressing process.

2, increase the line density: the interconnection of traditional circuit board and parts

3, conducive to the use of advanced construction technology

4. Better electrical performance and signal correctness

5. Heat properties can be improved

6. Improve rf interference/electromagnetic interference/electrostatic release (RFI/EMI/ESD)

7. Increase the efficiency of design


ten layer HDI circuit Board
1. Reduce the cost of PCB: when the density of PCB increases more than eight layers, the cost of HDI manufacturing will be lower than the traditional complex pressing process.
2, increase the line density: the interconnection of traditional circuit board
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  • For Reference: ICP 19122574
  • Address:Building20-21,Xinwei No3 Industry Zone,Phoenix Village,Fuyong Town,Baoan District,Shenzhen,Guangdong,China
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